Section V. DIRECT SUPPORT (INTERMEDIATE)TESTING PROCEDURE

(1) Apply plastic cement (FSN 8040-051-9222) to the mating surfaces of the rubber gasket and the inside of the

enclosure. Allow the cement to dry.

(2) Orient the vibration pickup assembly so that the attaching leads will be adjacent to the pc board. Align the

rubber gasket with the enclosure opening and firmly press into place.

(3) Orient the pc board so that the red and black pin connectors are adjacent to the vibration pickup assembly and

secure the pc board to the enclosure using four 6' - 32 x 3/8 inch long pan head screws.

(4) Connect the red and black leads from the vibration pickup assembly to the respective terminals on the pc

board.

(5) Mate the enclosure with the conduit and secure the conduit locknuts.

(6) Secure the enclosure to the mounting surface using the same hardware.

(7) Connect the identified interconnecting leads to their respective terminals on TB1.

Section V. DIRECT SUPPORT (INTERMEDIATE)TESTING

PROCEDURE

7-10. General

These testing procedures are prepared for use by electronic field maintenance shops and electronic service organizations

responsible for direct support (intermediate) maintenance of electronic equipment. These procedures set forth the

specific requirements that repaired electronic equipment must meet before it is returned to the using organizations.

7-11. Performance Test Procedures

Chart 7-2 establishes the minimum performance standards required for the determination of the serviceability of

assemblies maintained at the direct support (intermediate) category of maintenance.

NOTE

When performing the procedures disconnect all test equipment at the completion of each step with the exception of the

power supply. Set the power supply to off when connecting and disconnecting test setups. When connecting an audio

generator to circuit points, always isolate the signal lead with a 0.1 mfd capacitor.

Chart 7-2. Processor/Detector Vibration Signal Performance Test Procedure

Step

Test equipment

Test procedure

Performance standard

Note: Interconnect detector to processor.

Set SENSITIVITY control to 3 and GAIN

control to 10 db below maximum.

Power Supply

Connect positive lead to terminal 7 and

Set power supply for 20 Vdc.

negative lead to terminal 8 of TBI.

a. Oscilloscope

Connect between test point TP1 and

signal ground.

b. Audio generator and Connect via a 0.1 mfd capacitor to the

a 0.1 mfd capacitor.

red input terminal and signal ground.

a. Set the audio generator for an output

Input level shall be 0.7 millvolts rms + 3db.

of 1.2 volts rms at TP1.

b. Manually sweep the frequency from

Scope presentation indicates an output of

10 to 15 kHz.

1.2 rms 3db.

a. Multimeter as a

Connect between terminals 1 and 2 of

For a no alarm condition the multimeter

continuity check.

TB1.

indicates 110 ohms.

b. Audio generator

Connect via a 0.1 mfd capacitor to the

and a 0.1 mfd

red input terminal and signal

capacitor.

ground.

a. Set the audio generator at 12.5 kHz

Observe alarm output as indicated by

and an output of 0.7 millivolts.

multimeter, it should be cycling ap-

proximately every 4.5 seconds.

Note: The audio generator is pulsed on

and off by setting the FREQ.

RANGE

MULTIPLIER switch to an adjacent

position and back to the original

setting.

b. Pulse of audio generator in the off

Multimeter should indicate 110 ohms.

state and short circuit the INT test

point to signal ground to discharge

capacitor C 8.

7-5