Skidding of MCUs.

TM 38-260

(a) When this degree of protection cannot be assured, the heavy items shall be removed and processed

separately.

(b) In-place immobilization is preferable, when practical, to minimize electrical disconnections.

d. Packing. Packing shall be level A, level B, level C, or industrial as specified by the owning activity. Packing

shall be designed to comply with minimum weight and cubage requirements of AR 70-44.

e. Skidding of MCUs. MCUs need not be skidded unless the weight and size are such that skidding is essential for

safe handling, transportation, and storage.

(1) Units provided with rods or other means for securing circuit boards in place shall have these devices

installed.

(2) Units not provided with the above listed devices shall be fitted with corrugated fiberboard, cut to fit behind

the circuit boards, and secured in place with pressure-sensitive adhesive tape.

(3) All cabinet doors shall be locked and secured with nylon strapping conforming to PPP-S-76. Cushioning

shall be placed between the cabinet and strapping to prevent scratching or damaging the cabinet.

(4) Cabinet door keys shall be packaged in accordance with MIL-P-116, submethod C-1, identified to the

specific machine, and attached to the unit door(s) with pressure-sensitive adhesive tape.

f. MCU packing covers. All MCUs shall be protected from contaminants such as water and dirt by covering the

units with plastic material that conforms to L-P-378 or waterproof material conforming to PPP-B-1055, grade, type, and

class as applicable.

(1) All covers shall be of sufficient strength to provide adequate protection throughout the transit period.

(2) All sharp corners and projections of the unit shall be cushioned or padded to prevent the rupture of the

cover.

(3) The cover shall be secured in place with pressure-sensitive adhesive tape.

(4) All units shall be protected in this manner regardless of the type of transportation or packing specified.

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